(module Housings_SOIC:SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 58FF4591)
  (descr "8-Lead Thermally Enhanced Plastic Small Outline (SE) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SOIC 1.27")
  (attr smd)
  (fp_text reference U2 (at 0 -3.5) (layer F.SilkS))
  (fp_text value TL081 (at 0.1524 3.6322) (layer F.Fab))
  (pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (model Housings_SOIC.3dshapes/SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
